TRIO-TECH MANUFACTURED PRODUCTS:

 

TRIO-TECH HAST SYSTEM (Highly Accelerated Stress Test)

TRIO-TECH HAST SYSTEM

To evaluate the reliability of plastic encapsulated ICs and other microelectronics devices in humid environments. It employs severe conditions of temperature, humidity, bias or un-bias which accelerate the penetration of moisture through the external protective material (encapsulates or seal).

TRIO-TECH CENTRIFUGE SYSTEM (CENTRISAFE SERIES)

TRIO-TECH CENTRIFUGE SYSTEM

Centrisafe is a microprocessor controlled centrifugal accelerator. It performs high speed constant acceleration testing of electronic components under various “G” stresses. It’s suitable for testing of mechanical integrity of integrated circuits in bulk fixture form, Detect wire-bond and die-attach problems, as well as poor lead attachments, and poor seals in hermetic packages.

Its test range is not possible to achieve using other methods such as tumbling, vibration, or high-shock tests.

 

Specifications

  • Dimensions : 36” X 30” X 38”
  • Speed Control Torque (RPM):

Variable speed: 18 lb/ft or 23 lb/ft

Continuous Torque: 5 lb/ft or 9.5 lb/ft

Peak Torque: 0 - 19000 RPM

  • “G” Range: 0 - 40,000 Gs

 

TRIO-TECH GROSS & FINE LEAK PRESSURIZATION TEST SYTEM + TRIO-TECH BUBBLE TESTER SYSTEM

TRIO-TECH GROSS & FINE LEAK PRESSURIZATION TEST SYTEM & TRIO-TECH BUBBLE TESTER SYSTEM

(Components Leak Detection System)

Suitable for semiconductors application that requires testing for hermetic sealed by detecting leakages of the sealed ICs.

These equipment can be applicable for semiconductor or defence industry that requires high degree of quality in ICs’ components.

 

Gross and Fine Leak Pressurization Test Equipment Specs:

  • Vacuum Range: 0.5 to 5 Torr
  • Pressure Range: 20 to 125 Psia
  • Chamber Volume: 7 to 25 Liters

 

Bubble Tester Specs:

  • Temperature Range: 50 to 145°C
  • Chamber Volume: 3 to 12 Liters

 

TRIO-TECH ARTIC TEMPERATURE CONTROLLED WAFER CHUCKS

Artic Chuck

ARTIC TEMPERATURE CONTROLLED WAFER CHUCKS

The Artic TC series of temperature controlled wafer chucks are used for test and characterization of semiconductor wafers and other components at hot and cold temperatures.

Several models are available with temperature ranges from -65 degrees C to + 400 degrees C. Chucks are available in 4,6,8 and 12 inch diameters. These systems offer several design features which provide excellent performance to meet the most demanding customer applications.

Trio-Tech provides full turn-key solutions for wafer probing at hot and cold temperatures including triaxial guarding, rapid cool down units, probe station adapters, environmental enclosures, air dryers and dew point monitors.

 

TRIO-TECH INDUSTRIAL AUTOCLAVES SYSTEM

Autoclave

TRIO-TECH (EXPRESS TEST) – AUTOCLAVES SYSTEM

Our autoclave systems have been specially designed for pressure / temperature / humidity / bias (PTHB) testing of integrated circuits and other microelectronic materials. These systems provide pressurized, saturated vapour (100% R.H.) test environments for fast and easy monitoring of integrated circuit manufacturing processes.

Our Series I and Series II Systems provide several outstanding features at a cost comparable to many modified commercial sterilizers.

 

 

UNIVERSAL WET BENCH (MANUAL /SEMI-AUTOMATED)

 

UNIVERSAL WET BENCH (MANUAL /SEMI-AUTOMATED)

We develops and manufactures cleaning, rinsing, drying wet benches (manual, semi-automated and automated), ultrasonic and megasonic cleaning system for processing silicon wafers, flat panel displays and other microelectronic substrates.

Use different types of chemicals either for cleaning, etching or stripping processes of wafer or substrates. Selection of chemical would match the parts or material based on its application.

We also provide services for re-furbished and upgrading of existing Wet Stations

 

Our wet stations are compliance to the following standards:

SEMI (S2-93) Manufacturing Safety Guidelines, FM-200 Compliant and provide a wide range of bench materials: SS, PP, FM4910 approved material (FRPP, CPVC, etc)

 

UNIVERSAL NATURAL AND FORCE CONVECTION OVEN

UNIVERSAL OVEN

These ovens are used for drying, baking, heat treatment, disinfecting and thermal insulation tests. It’s is used in electronic, material, pharmaceutical, research institutions and manufacturers.

 

Specifications

  • Temperature Range: R.T+20 to 300°C (Force Convection)

R.T+20 to 200°C (Natural Convection)

  • Chamber Volume: 72 to 234 Litres (Force Convection)

31 to 165 Liters (Natural Convection)