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	Temperature and Pressurization Test System: Suitable for semiconductors application that requires curing and bonding of test samples. Other application of Autoclave testing, please feel to contact us. Specifications Temperature Range : Up to 180 º C. Pressure Range : Up to 100 Psig Chamber Volume: 9 to 160 Liters
	Temperature and Pressure Pulsation Test System: Pulse Pressure Temperature Control Chamber System, designed to process any chips that requires various setting parameters (eg. Temperature, pressure and other required parameters etc.). Specifications Temperature Range : 70 to 140 º C Pressure Range : Up to 50 Psig Chamber Volume: 9 to 160 Litres Pulse Width Range : 2 to 59 Seconds
	Components Leak Detection System:   Suitable for semiconductors application that requires testing for hermetic sealed by detecting leakages of the sealed ICs. These equipments can be applicable for semiconductor or defence industry that requires high degree of quality in IC components. Gross and Fine Leak Pressurization Test Equipment Specs: Vacuum Range : 0.5 to 5 Torr Pressure Range : 20 to 125 Psia Chamber Volume: 7 to 25 Liters   Bubble Tester Specs: Temperature Range : 50 to 145 º C Chamber Volume: 3 to 12 Liters
	Temperature and Humidity Test System:   Various parameters are chosen for the test on the reliability aspect of a PCB electronics cards / boards or a finished unit. These parts or units are placed into the chamber with given parameter and set to meet the test specification. The end result will be tested for functionality and reject for any mal-function component. As for Aerospace Industry: Black Box, Hard disk, memory recorder, navigation instrument and parts. Specifications Temperature Range : -70 to 180 º C Humidity Range : 10 to 98 % R.H Chamber Volume: 50 to 1500 Liters
	Temperature, Humidity and Pressure Test System:   To evaluate the reliability of plastic encapsulated ICs and other microelectronics devices in humid environments. It employs severe conditions of temperature, humidity, bias or un-bias which accelerate the penetration of moisture through the external protective material (encapsulates or seal). Specifications Temperature Range : 105 to 150 º C Humidity Range : 50 to 100 % R.H Chamber Volume: 60 to 160 Liters
	Thermal Shock Test System:   Various parameters are chosen for the test on the reliability aspect of a PCB electronics cards / boards or a finished unit. These parts or units are placed into the chamber with given parameter and set to meet the test specification. The end result will be tested for functionality and reject for any mal-function component. As for Aerospace Industry: Black Box, Hard disk, memory recorder, navigation instrument and parts. Specifications Temperature Range : -80 to 200 º C Chamber Volume: 32 / 130 / 350 Liters No. of Cycles: 3000 Cycles
	Natural and Force Convection Oven:   These ovens are used for drying, baking, heat treatment, disinfecting and thermal insulation tests. These are used in electronic, material, pharmaceutical, research institutions and manufacturers. Specifications Temperature Range : R.T+20 to 300 º C (Force Convection) R.T+20 to 200 º C (Natural Convection) Chamber Volume: 72 to 234 Liters (Force Convection) 31 to 165 Liters (Natural Convection)
	Vibration-Climatic Test System:   Combined Testing is a form of Reliability Testing which involves both the Mechanical Vibration and Temperature Testing to be done concurrently at the same time. This will help manufacturers cut short test time as both tests are performed at same time. Vibration Testing Specs: Frequency: 5 to 2600 Hz Max Velocity: 1.8m/s Max Acceleration: 66g Sine Force Rating Peak (kgf): 4000 Random Force Rating RMS (kgf): 4000 Shock Force Rating (4ms, ½ sine), (kgf): 8000 Slip Table Dimension: 1100mm x 1000mm Temperature Testing Specs: Temp Range : 21C to 250C Temp Ramp up Rate: 3C/min Testing Area Size: 350mm (35cm) SD-PUMA-Basic Vibration Controller Specs: Dynamic Range : > 80dB with 0.05 dB level step control over the full range Level Accuracy Control: Within ±1dB at a sweep rate of 1 oct/min Sweep Frequency Resolution: ±0.5% of the drive frequency Loop Time: < 5 msec for single channel control Compression Rate: Up to 3,500 dB/sec with unconditionally stable feedback control loop Harmonic Distortion: <-75 dB at full output
	Walk-In Chamber:   Walk-In chamber are ideal for applications that require high temperature testing over 93°C, high humidity, rapid temperature change rates, or combined environmental testing with altitude simulation. Walk-in chambers are also used for other custom applications. The chamber is compliance to solar testing standards: IEC 61215 10.11/10.12/10.13, IEC 61215 10.11/10.13, IEC 61215 10.12 Specifications Temperature Range : -70 to 180 º C Humidity Range : 10 to 98 % R.H Test space capacity: > 2m³
	Sputtering System:   SEM sample preparation, CV Dot Matrix, Sputtering thin film layers, unbalanced magnetrons and Plasma cleaning for both metals and insulators in R&D and production. Specifications Chamber with High vacuum pumping system (with load lock) Transfer Arm System Sputtering Cathode Ion beam source Ion plating cathode 3D rotational substrate holder Customized heater up to 1000 deg C Accurate process temperature control
	Ultrasonic System:   Applications include cleaning equipment and parts of nearly any description to degrease and remove oil, buffing compound, vibratory finishing media, chips, and other soluble and non-soluble contaminants utilizing aqueous and solvent-based chemistries. The smallest ultrasonic cleaners utilize a single ultrasonically activated tank for use in limited production or very low throughput applications. A complete, ultrasonic cleaning system designed for high production use often consists of an ultrasonic cleaning station, one or more ultrasonic rinse stations and a dryer all within a single console. Automated operation and parts handling reduce labor requirements and assure process consistency. Specifications Heater Power: 600 to 7000 Watts Ultrasonic Power: 300 to 4000 Watts Tank Capacity: 6 to 160 Liters
	Centrisafe System:   Centrisafe is a microprocessor controlled centrifugal accelerator. It performs high speed constant acceleration testing of electronic components under various “G” stresses. It’s suitable for testing of mechanical integrity of integrated circuits in bulk fixture form, Detect wire-bond and die-attach problems, as well as poor lead attachments, and poor seals in hermetic packages. Its test range is not possible to achieve using other methods such as tumbling, vibration, or high-shock tests. Specifications Dimensions : 36” X 30” X 38” Speed Control Torque (RPM): Variable speed: 18 lb/ft or 23 lb/ft Continuous Torque: 5 lb/ft or 9.5 lb/ft Peak Torque: 0 – 19000 RPM “G” Range : 0 – 40,000 Gs
	Wet Cleaning Station (Wet Bench): We develop and manufacture cleaning, rinsing, drying wet benches (manual, semi-automated and automated), ultrasonic and megasonic cleaning system for p rocessing silicon wafers, flat panel displays and other microelectronic substrates . Use different types of chemicals either for cleaning, etching or stripping processes of wafer or substrates. Selection of chemical would match the parts or material based on its application. We also provide services for re-furbished and upgrading of existing Wet Stations. Our wet stations are compliant to the following standards: SEMI (S2-93) Ma nufacturing Safety Guidelines, FM-200 Compliant and p rovide a wide range of bench materials: SS, PP, FM4910 approved material (FRPP, CPVC, etc) Specifications: Automated Transfer Types: Pneumatic Robot Transfer System Servomotor Robot Transfer System Linear Robot Transfer System Process Tanks : Tank sizes are built to accommodate the processes Ambient tank, Overflow cascade rinser, Utility Sink Low/Med/High temperature Re-circulating, Filtered Tanks Ultrasonic Tank Megasonic Tank Materials: PP, PVDF, PFA, Quartz, SS