Assembly & Inspection System

Automated Optical Inspection System (AOI)

AI-powered AOI automates wire bond and chip inspection—boosting throughput while eliminating human error.

1. In-house developed optical system with tunable RGB lighting and dynamic motion-compatible inspection

2. Customized platform for inline/offline production, featuring fail-safe feeding, adjustable track height, and modular barcode reading (manual/auto), with inkjet/laser marking

3. Boost inspection accuracy with AI-driven multi-layer imaging and instant 3D analysis

4. Offline/online re-inspection system

Packaged Products:

IC, SOP, BGA, QFP, SIP, Flip Chip, Memory, etc.

Eutectic Die Bonder

Eutectic Die Bonder

1. Adaptable Eutectic Bonding System with Multi-Stage Temperature Control. (pre-heating/heating/cooling)

2. Eutectic process inert gas anti-oxidation solution

3. Optimized bond head enable larger die support while maximizing production capacity

4. Bond different-sized dies with precision using standard and flip-chip bonding solutions, featuring up to seven nozzles and five ejector pins for unmatched efficiency and flexibility.

5. Full automation: support automatic loading and production line

6. Improve force control accuracy and stability: Air-bearing structure in the center eliminates friction, awarded an invention patent

Packaged Products:

Monolithic Integrated Circuits, RF Chips, Sensor Chips, Power Chips, etc.

Assembly & Inspection System